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Tender Details
- Country: United Kingdom
- Summary: Laser Dicing and Drilling System
- GBT Ref No: 52747272
- Deadline: 01 Jun 2021
- Competition: ICB
- Financier: Self Financed
- Purchaser Ownership: -
- Tender Value: 350000
- Notice Type: Tender
- Document Ref. No.:
- Purchaser's Detail :
- Description :
- Title : Laser Dicing and Drilling System
Location Of Contract : Wales
Industry : Laboratory, optical and precision equipments (excl. glasses) - 38000000
Value Of Contract : £250,000 to £350,000
Description : The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes.As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and pr... - Documents :
Purchaser : COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
CSA Catapult Innovation Centre Celtic Way Imperial Park Newport NP10 8BE Wales
Email :procurement@csa.catapult.org.uk
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