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Tender Details
- Country: United Kingdom
- Summary: Chip Cleave & Break System
- GBT Ref No: 71053061
- Deadline: 26 Sep 2022
- Competition: ICB
- Financier: Self Financed
- Purchaser Ownership: Public
- Tender Value: 200000
- Notice Type: Tender
- Document Ref. No.: 475145-2022
- Purchaser's Detail :
- Description :
- The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool
Doc Title: Laboratory, optical and precision equipments (excl. glasses)
Contract Type: Supplies - Documents :
Purchaser : CARDIFF UNIVERSITY
Address : 30-36 Newport Road
Town : Cardiff
NUTS-Code : UKL - Wales
Postal Code : CF24 0DE
Contact Point : Anthony Hale
Phone : +44 2920879648
Email :halea3@cardiff.ac.uk
URL :http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers
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