- Country: United Kingdom
- Summary: Wafer Thinning for the National Manufacturing Institute of Scotland (Nmis)
- GBT Ref No: 117078819
- Deadline: 17 May 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: GBP 1200000.00
- Notice Type: Tender
- Document Ref. No.: APR527305
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- Description:
- NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m
Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)
Purchaser : University of Strathclyde
Published : 01/04/2025
Deadline : - Documents:
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CLICK HERE TO LOGINWafer Thinning for the National Manufacturing Institute of Scotland (Nmis) - Greatbritain Tender
The UNIVERSITY OF STRATHCLYDE, a Government sector organization in United Kingdom, has announced a new tender for Wafer Thinning for the National Manufacturing Institute of Scotland (Nmis). This tender is published on GreatbritainTenders under GBT Ref No: 117078819 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-05-17.
The estimated tender value is GBP 1200000.00, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
