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Tender Details
- Country: United Kingdom
- Summary: Wafer Thinning for the National Manufacturing Institute of Scotland (Nmis)
- GBT Ref No: 117078819
- Deadline: 17 May 2025
- Competition: ICB
- Financier: Self Financed
- Purchaser Ownership: Public
- Tender Value: 1200000.00
- Notice Type: Tender
- Document Ref. No.: APR527305
- Purchaser's Detail :
- Description :
- NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m
Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)
Purchaser : University of Strathclyde
Published : 01/04/2025
Deadline : - Documents :
Purchaser : UNIVERSITY OF STRATHCLYDE
University of Strathclyde
Learning & Teaching Building, 49 Richmond Street
Glasgow
G1 1XU
UK
Contact person: Anna Sanina
Telephone: +44 7811592949
Email :anna.sanina@strath.ac.uk
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