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Wafer Dicing Saw and Post Wafer Cleaning

GreatbritainTenders notice for Wafer Dicing Saw and Post Wafer Cleaning. The reference ID of the tender is 100471461 and it is closing on 28 May 2024.

Tender Details

  • Country: United Kingdom
  • Summary: Wafer Dicing Saw and Post Wafer Cleaning
  • GBT Ref No: 100471461
  • Deadline: 28 May 2024
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: GBP 205000
  • Notice Type: Tender
  • Document Ref. No.: 2024UoS-1289
  • Purchaser's Detail:
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  • Description:
  • Title : Wafer Dicing Saw and Post Wafer Cleaning
    Location Of Contract : South East
    Industry : Laboratory, optical and precision equipments (excl. glasses) - 38000000
    Value Of Contract : £205,000
    Description : The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing.This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials.This dicing machine will allow the fabrication of new devices that will tackle fundamental research problems in quantum light-matter interactions, quantum sensors, and telecommunications.How to obtain Tender Documents:Website: https://in-tendhost.co.uk/universityofsouthampton/aspx/HomeThe Tender documents can be access when logged into In-Tend by selecting 'View Details' on the relevant tender advert and c licking the 'Express In...
  • Documents:

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Wafer Dicing Saw and Post Wafer Cleaning - Greatbritain Tender

The UNIVERSITY OF SOUTHAMPTON, a Government sector organization in United Kingdom, has announced a new tender for Wafer Dicing Saw and Post Wafer Cleaning. This tender is published on GreatbritainTenders under GBT Ref No: 100471461 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2024-05-28.

The estimated tender value is GBP 205000, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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