Tender Details

Country: United Kingdom
Summary: Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey Itt
GBT Ref No: 119474846
Deadline: 20 Jun 2025
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: GBP 2000000.00
Notice Type: Tender
Document Ref. No.: MAY530711
Purchaser's Detail:
Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details.
Login to see details
Description:
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.High-efficiency grinder/polisher for wafersA Deionised Water Recycling UnitAutomatic Cleaning System for wafers
Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT
Purchaser : University of Strat...
Documents:

If you are registered member, kindly login to view full details of this tender notice:

Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey Itt - Greatbritain Tender

The UNIVERSITY OF STRATHCLYDE, a Government sector organization in United Kingdom, has announced a new tender for Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey Itt. This tender is published on GreatbritainTenders under GBT Ref No: 119474846 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-06-20.

The estimated tender value is GBP 2000000.00, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.