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Laser Dicing and Drilling System

GreatbritainTenders notice for Laser Dicing and Drilling System. The reference ID of the tender is 52747272 and it is closing on 01 Jun 2021.

Tender Details

  • Country: United Kingdom
  • Summary: Laser Dicing and Drilling System
  • GBT Ref No: 52747272
  • Deadline: 01 Jun 2021
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: GBP 350000
  • Notice Type: Tender
  • Document Ref. No.:
  • Purchaser's Detail:
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  • Description:
  • Title : Laser Dicing and Drilling System
    Location Of Contract : Wales
    Industry : Laboratory, optical and precision equipments (excl. glasses) - 38000000
    Value Of Contract : £250,000 to £350,000
    Description : The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes.As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and pr...
  • Documents:

 Tender Notice

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Laser Dicing and Drilling System - Greatbritain Tender

The COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED, a Government sector organization in United Kingdom, has announced a new tender for Laser Dicing and Drilling System. This tender is published on GreatbritainTenders under GBT Ref No: 52747272 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2021-06-01.

The estimated tender value is GBP 350000, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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